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asmt-mxx9 moonstone? 1w power led light source data sheet description the moonstone? 1w power led light source is a high performance energy ecient device which can handle high thermal and high driving current. the exposed pad design has excellent heat transfer from the package to the motherboard. it is available in various color temperatures ranging from 2600k to 10000k. the package is compatible with reow soldering. to facilitate easy pick and place assembly, the leds are also available in eia-compliant tape and reel. the 1w power led light source can be mounted onto metal core pcb enabling optimum heat dissipation and ease of installation. features available in cool white & warm white color energy ecient exposed pad for excellent heat transfer suitable for reow soldering process high current operation long operation life wide viewing angle silicone encapsulation non-esd sensitive (threshold >16kv) msl 4 products applications sign backlight, billboard illumination or backlight exit sign or emergency sign lightings commercial lightings accent and marker lightings pathway lighting task lighting reading lights decorative lighting garden lighting architectural lighting portable (ash light, bicycle head light)
2 package dimension for moonstone? figure 1. moonstone? package outline drawing. notes: 1. all dimensions in millimeters. 2. tolerance is 0.1 mm unless otherwise specied. package dimension for moonstone? on mcpcb figure 2. mcpcb i package outline drawing. figure 3. mcpcb ii package outline drawing. ? 3. 00 ? 5 . 00 2 4 . 00 2.3 0 1 .3 0 4 . 60 1 9. 00 4 . 00 16 . 00 2 0 . 00 14 . 00 2. 50 1 . 40 r 1 . 60 ? 1 9. 00 60 1 9.9 0 3. 00 3.3 0 4 .9 0 1 . 60 ca t hode anode 1 2 3 h ea t sink notes: 1. all dimensions in mm. 2. tolerance = 0.10mm unless otherwise specied. 3. terminal nish: ag plating. 4. metal slug is connected to anode. metal slug cathode anode 1 2 3 1 0 . 00 8. 50 3 1 2 8. 50 ? 5 .2 6 ? 8. 00 5 . 0 8 0 .81 2. 00 5 .2 5 1.3 0 1 0 . 60 1.27 3.3 0 heat sink led zene r + ?
3 part numbering system note: 1. please refer to page 7 for selection details. asm t -m x x 1 x 2 x 5 x 6 packaging op t ion co l or bin se l ec t ion maximum - fl ux bin se l ec t ion minimum - fl ux bin se l ec t ion moons t one? t ype 0 C non-diffused b C diffused a C non-diffused on mcpcb i c C diffused on mcpcb i k C non-diffused on mcpcb ii l C diffused on mcpcb ii co l or w C coo l white y C warm white 9 C n x 34 device selection guide (t j = 2 5 c) for moonstone? part number color luminous flux, v [1,2] (lm) test current (ma) dice technology electrically isolated metal slug min. typ. max. asmt-mw0 9 -nlm00 cool white 73.0 9 0.0 124.0 3 5 0 ingan no asmt-mw0 9 -nmm00 95 .0 100.0 124.0 3 5 0 ingan no asmt-m y 0 9 -nkm00 warm white 5 6.0 7 5 .0 124.0 3 5 0 ingan no asmt-m y 0 9 -nlm00 73.0 80.0 124.0 3 5 0 ingan no asmt-mwb 9 -nlm00 cool white diused 73.0 87.0 124.0 3 5 0 ingan no asmt-m y b 9 -nkm00 warm white diused 5 6.0 72.0 124.0 3 5 0 ingan no device selection guide (t j = 2 5 c) for moonstone? on mcpcb part number color luminous flux, v [1,2] (lm) test current (ma) dice technology electrically isolated metal slug min. typ. max. asmt-mwk 9 -nlm00 cool white 73.0 9 0.0 124.0 3 5 0 ingan no asmt-m y k 9 -nkm00 warm white 5 6.0 7 5 .0 124.0 3 5 0 ingan no notes: 1. v is the total luminous ux output as measured with an integrating sphere at 2 5 ms mono pulse condition. 2. flux tolerance is 10 %.
4 absolute maximum r atings parameter asmt-mxx9 units dc forward current [1] 5 00 ma power dissipation 2100 mw led junction temperature 12 5 c operating metal slug temperature range at 3 5 0 ma -40 to +110 c operating metal slug temperature range at 5 00 ma -40 to +10 5 c storage temperature range -40 to +120 c soldering temperature refer to figure 14 reverse voltage [2] not recommended notes: 1. derate linearly based on figure 11. 2. not designed for reverse bias operation. optical characteristics at 3 50 ma (t j = 2 5 c) part number color correlated color temperature, cct (kelvin) viewing angle, 2 ? [2] () luminous eciency (lm/w) min. max. typ. typ. asmt-mw0 9 -nlm00 cool white 4000 10000 110 71 asmt-mwk 9 -nlm00 4000 10000 110 71 asmt-mw0 9 -nmm00 4000 10000 110 7 9 asmt-m y 0 9 -nkm00 warm white 2600 4000 110 60 asmt-m y 0 9 -nkm00 2600 4000 110 60 asmt-m y 0 9 -nlm00 2600 4000 110 63 asmt-mwb 9 -nlm00 cool white diused 4000 1000 110 6 9 asmt-m y b 9 -nkm00 warm white diused 2600 4000 110 5 7 notes: 1. ? is the o-axis angle where the luminous intensity is ? the peak intensity. electrical characteristic at 3 50 ma (t j = 2 5 c) dice type forward voltage, v f (volts) thermal r esistance, r j-ms (c/w) [1] thermal r esistance, r j-b (c/w) [2] min. typ. max. typ. typ. ingan 3.2 3.6 4.0 10 14 notes: 1. r j-ms is the thermal resistance from led junction to metal slug. 2. r j-b is the thermal resistance from led junction to mcpcb.
5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 wavelength - nm relative intensity 0 50 100 150 200 250 300 350 400 450 500 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 v f - forward voltage - v i f - forward current - ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 i f - forward current - ma relative luminous flux - lm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -60 -30 0 30 60 90 angular displacement - relative intensity -0.004 -0.003 -0.002 -0.001 0.000 0.001 0.002 -0.003 -0.002 -0.001 0.000 0.001 0.002 x - coordinates y - coordinates 50ma 500ma 350ma 250ma 150ma -0.004 -0.003 -0.002 -0.001 0.000 0.001 0.002 -0.002 -0.001 0.000 0.001 0.002 0.003 x - coordinates y - coordinates 50ma 500ma 350ma 250ma 150ma cool white warm white figure 4 . r elative intensity vs. wavelength figure 5 . forward voltage vs. forward current. figure 6 . r elative luminous ux vs. forward current. figure 7. r adiation pattern. figure 8. chromaticity coordinate shift vs. forward current (c ool white). figure 9. chromaticity coordinate shift vs. forward current (warm white).
6 (acc. to j-std-020c) 217c 200c 60 - 120 sec. 6c/sec. max. 3c/sec. max. 3c/sec. max. 150c 255 - 260c 100 sec. max. 10 to 30 sec. time temperature 10.700.10 8.400.10 3.10.10 5.080.10 1.000.10 17.000.20 0 100 200 300 400 500 600 0 20 40 60 80 100 t a - ambient temperature - c max. allowable dc current - ma 0 100 200 300 400 500 600 0 20 40 60 80 100 120 140 t ms - metal slug temperature - c max. allowable dc current - ma r j-ms = 10c/w r j-a = 30c/w r j-a = 50c/w r j-a = 40c/w 0 0.2 0.4 0.6 0.8 1 1.2 -40 -20 0 20 40 60 80 100 120 t j - junction temperature -c t j - junction temperature -c relative light output (normalised to 25c) cool white warm white -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 -40 -20 0 20 40 60 80 100 120 forward voltage shift - v (normalised to 25c) cool white & warm white figure 1 0 . r elative light output vs. junction temperature. figure 11. forward voltage shift vs. junction temperature. figure 12. maximum forward current vs. ambient temperature f igure 13. maximum forward current vs. metal slug temperature figure 1 4 . r ecommended soldering prole. figure 1 5 r ecommended soldering land pattern. note: for detail information on reow soldering of avago surface mount leds, do refer to avago application note an1060 surface mounti ng smt led indicator components.
7 option selection details asmt - m x 1 x 2 9 - n x 3 x 4 x 5 x 6 x 3 = minimum ux bin x 4 = maximum ux bin x 5 = color bin selection x 6 = packaging option color bin selections [x 5 ] individual reel or tube will contain parts from one color bin selection only. cool white selection bin id 0 full distribution a a only b b only c c only d d only e e only f f only g g only h h only l a and g only m b and h only n a and c only p b and d only q e and c only r f and d only s g and h only u e and f only w c and d only z a and b only 1 a, b, c and d only 2 g, h, a and b only 4 c, d, e and f only warm white selection bin id 0 full distribution a a only b b only c c only d d only e e only f f only n a and c only p b and d only q e and c only r f and d only u e and f only w c and d only z a and b only 1 a, b, c and d only 4 c, d, e and f only flux bin limit [x 3 x 4 ] bin id luminous flux (lm) @ i f = 3 50 ma min max k 5 6.0 73.0 l 73.0 95 .0 m 95 .0 124.0 tolerance: 10%
8 color bin limit cool color limits white (chromaticity coordinates) bin a x 0.367 0.362 0.32 9 0.32 9 y 0.400 0.372 0.34 5 0.36 9 bin b x 0.362 0.3 5 6 0.32 9 0.32 9 y 0.372 0.330 0.302 0.34 5 bin c x 0.32 9 0.32 9 0.30 5 0.301 y 0.36 9 0.34 5 0.322 0.342 bin d x 0.32 9 0.32 9 0.311 0.30 5 y 0.34 5 0.302 0.28 5 0.322 bin e x 0.303 0.307 0.283 0.274 y 0.333 0.311 0.284 0.301 bin f x 0.307 0.311 0.2 9 0 0.283 y 0.311 0.28 5 0.26 5 0.284 bin g x 0.388 0.37 9 0.362 0.367 y 0.417 0.383 0.372 0.400 bin h x 0.37 9 0.36 9 0.3 5 6 0.362 y 0.383 0.343 0.330 0.372 tolerance: 0.01 figure 1 6 . color bins (cool white) figure 17. color bins (warm white) packaging option [x 6 ] selection option 0 tube (for moonstone? only) tray (for moonstone? on mcpcb only) 1 tape & reel warm color limits white (chromaticity coordinates) bin a x 0.4 5 2 0.488 0.470 0.438 y 0.434 0.447 0.414 0.403 bin b x 0.438 0.470 0.4 5 2 0.424 y 0.403 0.414 0.384 0.376 bin c x 0.407 0.418 0.4 5 2 0.438 y 0.3 9 3 0.422 0.434 0.403 bin d x 0.3 95 0.407 0.438 0.424 y 0.362 0.3 9 3 0.403 0.376 bin e x 0.381 0.387 0.418 0.407 y 0.377 0.404 0.422 0.3 9 3 bin f x 0.373 0.381 0.407 0.3 95 y 0.34 9 0.377 0.3 9 3 0.362 tolerance: 0.01 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 b c e d a f 7 k 1 0 k 4.0 k g h 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 x - coord i na t e b c e d a f 3.0 k 3.5 k 4.0 k 2.6 k 5.6 k 4.5 k b l ac k bo dy c u r v e b l ac k bo dy c u r v e y - coord i na t e x - coord i na t e y - coord i na t e example asmt-mw0 9 -nlmz1 asmt-mw0 9 -nxxxx - cool white, non-diused x 3 = l - minimum flux bin l x 4 = m - maximum flux bin m x 5 = z - color bin a and b only x 6 = 1 - tape and reel option
9 535.00 1 .00 5.45 5.80 4.65 5.50 1 0. 1 0 37.00 8.30 t op v i ew s i de v i ew quantity per tube = 2 5 pcs figure 18. tube dimensions figure 19. carrier tape dimensions dim value ao 8.800.10 bo 16.4 5 0.10 ko 3.600.1 e 1.7 5 0.10 f 11. 5 00.10 w 24.00.10 p 16.00.10 q'ty/reel 2 5 0 units all dimensions in mm. packing tube - option 0 tape and r eel - option 1 a a b ao b p sec ti on b sec ti on a k o w f e bo 2.5
10 figure 2 0 . carrier tape leader and trailer dimensions figure 21. r eel dimensions end minimum of 160 mm of empty component poc k ets sealed with cover tape. mounted with components minimum of 390 mm of empty component poc k ets sealed with cover tape. start *note: tape & reel packaging only applicable as per this datasheet only. r 1 0.00 60.0 o ? 268.00 330.00 1 .00 ? 99.50 1 .00 2.30 2.30 24.0 +1 .00 - 0.00 ? 1 3.50 0.50 2.50 0.50 r 1 0.50 0.50 1 20.0 o ?
11 packing tray - option 0 (for moonstone? on mcpcb only) figure 22. tray dimensions.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1449en - september 28, 2010 handling precaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an 5 288 for detail infor- mation. moisture sensitivity this product is qualied as moisture sensitive level 4 per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an 5 30 5 handling of moisture sensitive surface mount devices for details. a. storage before use C unopen moisture barrier bag (mbb) can be stored at <40c/ 9 0%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to reow the leds per the original msl rating. C it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb C the humidity indicator card (hic) shall be read immediately upon opening of mbb. C the leds must be kept at <30c/60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. c. control for unnished reel C for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at < 5 %rh. d. control of assembly boards C if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at < 5 %rh to ensure no leds have exceeded their oor life of 72 hours. e. baking is required if C hic 10% indicator is not blue and 5 % indicator is pink. C the leds are exposed to condition of >30c/60% rh at any time. C the leds oor life exceeded 72hrs. recommended baking condition: 60 5 c for 20hrs.

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